Industry Profile - Spring 2009

3D in Electronic Design Automation (EDA)

For Electronic Design Automation (EDA) applications and designers, 3D physical analysis has moved into the mainstream, reducing the need to re-design and delivering more predictable product performance and reliability. Two main factors driving the need for precise 3D geometric modeling and analysis within the EDA industry are high frequency switching and characterization of manufacturing variations. Understanding the physical characteristics of wireless clients, advanced packaging, die stacking, and scaled manufacturing processes is critical to the delivery of high-quality products.

Physical analysis within EDA applications requires high-performance 3D geometry creation, modeling, meshing and display capabilities. These functions provide an understanding of complex behaviors in various electronic design areas, including:

Integrated Circuit design and analysis
Package and board power delivery
Die-packaging thermal profiles and thermal-induced stress
DFM IC library characterization
TCAD process simulation
IC critical path cross talk
RF IC and system integrity

For those more familiar with 3D analysis in mechanical design, it is worth noting the characteristic differences between electrical and mechanical application domains. These differences need to be considered when implementing 3D modeling, visualization and pre and post processing technology within an EDA application.

The differences can be summarized as follows:

In addition, EDA application developers must understand end-user capabilities and needs. As an example, the EDA user typically has little or no experience in 3D modeling and meshing. Consequently, any solution needs to automate as much as possible between electrical design and 3D geometry creation, clean-up and meshing to eliminate the need for user intervention. In mechanical design and analysis this level of automation is not necessary since the typical mechanical designer is knowledgeable and accustomed to interactive and iterative design and analysis process.

Spatial 3D software components address both mechanical design and EDA application requirements. By choosing component technology, EDA application developers can more rapidly introduce 3D capabilities within their applications and reduce the risk of developing their own competency in 3D. Plus, receive the benefits from technology that is already being successfully used in hundreds of commercial applications.

Download White Paper:
3D Modeling and Analysis in EDA Applications

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