Convert IAM to Parasolid in your application
3D InterOp is a CAD interoperability SDK that lets your software read IAM files and write Parasolid, with exact B-Rep geometry carried across and nothing tessellated.
Spatial does not offer an online converter or a desktop conversion app. 3D InterOp is a component that software vendors embed in their own products.
- Reads Inventor assembly · Writes Parasolid
- Exact geometry → exact geometry
- C++ / C# APIs
IAM to Parasolid at a glance
Both formats store exact geometry, so the model stays exact. The differences are in the product data each one can carry.
| Inventor assembly (source) | Parasolid (target) | |
|---|---|---|
| Full name | Autodesk Inventor Assembly | Parasolid transmit file (text X_T, binary X_B) |
| Standard / owner | Autodesk | Proprietary — Siemens |
| File extensions | .iam | .x_t, .x_b, .xmt_txt, .xmt_bin |
| Geometry | Exact B-Rep (in the referenced parts) | Exact B-Rep |
| Assemblies / structure | Yes | Yes (Parasolid assembly structure) |
| 3D InterOp support | Read only | Read and write · up to Parasolid 38 |
What's preserved, what changes
Here is what your application can expect to carry across from Inventor assembly to Parasolid.
-
Preserved
Exact geometrySolids and surfaces stay exact B-Rep. The model is never reduced to a triangle mesh.
Why software vendors add IAM to Parasolid conversion
Hand models to kernel-based applications
Many CAD, CAM and CAE applications are built on the Parasolid kernel. Writing Parasolid gives them exact geometry they can load without another translation step.
Downstream modeling and analysis
An exact Parasolid B-Rep can still be edited, meshed or machined by downstream tools, which a tessellated export would not allow.
Exchange within one ecosystem
Partners whose tools share the Parasolid kernel often prefer to exchange Parasolid files directly.
Things to check before you ship
- Written Parasolid versions: Parasolid 12 to 38.0.150.
- Writing Parasolid needs a Parasolid installation: there is no Parasolid Direct writer.
- Supported IAM input: Inventor V11 to 2027.
- Validate a sample of translated files in the target system your users actually work with.
Working with Spatial was a real milestone for us: Thanks to the powerful 3DInterOp library, we were able to successfully bring our complex CAD-based solutions to the cloud while remaining flexible to meet individual customer requirements. For us, Spatial is not just a technology partner, but a true enabler of our product strategy.
Dr. Arno Michelis, Founder, Simus Systems
Read the Case StudyAbout the formats
-
Source format
What is an IAM (.iam) file?
An IAM file is an Autodesk Inventor assembly. It stores the product structure and constraints, and references the IPT part files.
-
Target format
What is a Parasolid (X_T) file?
Parasolid is the geometric modeling kernel developed by Siemens and used by many CAD, CAM and CAE applications. Its transmit files store exact B-Rep models as text (.x_t) or binary (.x_b).
Frequently asked questions
Yes. Both formats store exact B-Rep geometry, so the model is translated without being tessellated into triangles.
Parasolid has no assembly hierarchy, so your application decides how the IAM structure is grouped or flattened before writing.
Yes. Writing Parasolid needs a Parasolid installation: there is no Parasolid Direct writer.
3D InterOp reads Inventor V11 to 2027.
3D InterOp writes Parasolid 12 to 38.0.150.
No. 3D InterOp reads IAM but doesn’t write it. To send data back to Inventor users, write a neutral format they can import, such as STEP.
-
Building software that needs to convert IAM to Parasolid?
3D InterOp is an SDK that lets your application read Inventor assembly and write Parasolid alongside 30+ CAD and BIM formats.